MORRIS TOWNSHIP, NJ-- Honeywell has announced that it has developed a new lead-free packaging technology that improves the thermal management of semiconductor chips.
The new product, called Honeywell Pb-free Die Attach Solder, is a lead-free thermal interface material that effectively manages the tremendous heat produced by semiconductor chips in order to improve chip reliability.
"Honeywell has been developing lead-free die attach solder alloys for many years to meet the industry's 'green' requirements that emerged with the use of lead-free solder at the circuit board level," said Scott Miller, metals product line manager for Honeywell Electronic Materials. "Our newest alloys will replace the high-lead alloys and provide better thermal management than other proposed lead-free thermal management alternatives such as polymer-based materials."
As semiconductors become more powerful and smaller, more heat is being generated in a confined space when semiconductors are packaged for use in computers and other applications. This tremendous heat can damage the semiconductor or degrade its performance. Honeywell's thermal management materials are designed to help the semiconductor packaging industry dissipate this heat by filling the gap between the semiconductor and the heat spreader.
Demand for lead-free solders is growing, driven in part by regulation. Honeywell's new Pb-free Die Attach Solder is an advanced technology that is not only better for the environment, but is also cost effective. Lead-based solders are currently used for power/discrete die attach because they have a very good combination of melting temperature, wetting behavior, and mechanical properties. The new lead-free solder alloys are designed to meet these requirements, particularly resistance to melting during board level solder reflow.
Targeting the semiconductor industry's power device segment, Pb-free Die Attach Solder will be used in chips that service a wide range of industries, from automotives to cell phones.
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